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Laser Marking Systems: The Precision Engraving Solution for the PCB Industry
As demands for precision and traceability grow in PCB production,
June 16, 2025
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Suitable for high-demand customers
No thermal effect, no material burning
Low power consumption, stable performance
1. Food packaging materials
2.Pharmaceutical packaging materials
3.Glass materialsSilicon wafers
4.Precision plastics
| Tagged speed | 6000mm/s |
| Positioning speed | 10000mm/s |
| recording speed | 510cps |
| Step response time (1% of full trip) | ≤0.08ms |
| zero drift | <25μRad/°C |
| input voltage | ±15VDC |
| Maximum average operating current | <1.5A |
| signal interface | 数字: XY2-100; 模拟: ±5V |
| working temperature | 25±20°C |
| Laser input aperture | 10mm |
| Mechanical scanning Angle | ±12.5° |
| system requirements | windows7,10,11 |
Suitable for marking on food and pharmaceutical packaging materials, high-speed division of glass materials, complex graphic cutting of silicon wafers, marking of electronic components and precision plastics.
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